Global MEMS Packaging Market Insights, Forecast to 2028

MEMS Packaging is a method of protecting microelectromechanical system (MEMS) devices from the environment by means of physical enclosures.

Market Analysis and Insights: Global MEMS Packaging Market

The global MEMS Packaging market size is projected to reach US$ 85640 million by 2028, from US$ 42380 million in 2021, at a CAGR of 10.1% during 2022-2028.

Fully considering the economic change by this health crisis, Inertial Sensors Packaging accounting for % of the MEMS Packaging global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR in the post-COVID-19 period. While Automotive segment is altered to an % CAGR throughout this forecast period.

China MEMS Packaging market size is valued at US$ million in 2021, while the North America and Europe MEMS Packaging are US$ million and US$ million, severally. The proportion of the North America is % in 2021, while China and Europe are % and % respectively, and it is predicted that China proportion will reach % in 2028, trailing a CAGR of % through the analysis period. Japan, South Korea, and Southeast Asia are noteworthy markets in Asia, with CAGR %, %, and % respectively for the next 6-year period. As for the Europe MEMS Packaging landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period.

With industry-standard accuracy in analysis and high data integrity, the report makes a brilliant attempt to unveil key opportunities available in the global MEMS Packaging market to help players in achieving a strong market position. Buyers of the report can access verified and reliable market forecasts, including those for the overall size of the global MEMS Packaging market in terms of revenue.

Overall, the report proves to be an effective tool that players can use to gain a competitive edge over their competitors and ensure lasting success in the global MEMS Packaging market. All of the findings, data, and information provided in the report are validated and revalidated with the help of trustworthy sources. The analysts who have authored the report took a unique and industry-best research and analysis approach for an in-depth study of the global MEMS Packaging market.

Global MEMS Packaging Scope and Market Size

MEMS Packaging market is segmented by players, region (country), by Type and by Application. Players, stakeholders, and other participants in the global MEMS Packaging market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by Type and by Application for the period 2017-2028.

Segment by Type

Inertial Sensors Packaging

Optical Sensors Packaging

Environmental Sensors Packaging

Ultrasonic Sensors Packaging

Others

Segment by Application

Automotive

Mobile Phones

Consumer Electronics

Medical Systems

Industrial

Others

By Company

ChipMos Technologies Inc.

AAC Technologies Holdings Inc.

Bosch Sensortec GmbH

Infineon Technologies AG

Analog Devices, Inc.

Texas Instruments Incorporated.

Taiwan Semiconductor Manufacturing Company Limited

MEMSCAP

Orbotech Ltd.

TDK Corporation

By Region

North America

United States

Canada

Europe

Germany

France

UK

Italy

Russia

Nordic Countries

Rest of Europe

Asia-Pacific

China

Japan

South Korea

Southeast Asia

India

Australia

Rest of Asia

Latin America

Mexico

Brazil

Rest of Latin America

Middle East & Africa

Turkey

Saudi Arabia

UAE

Rest of MEA