Die Attach Film is adhesive film which is used for semiconductor process. It is combined with dicing tape, and it is called as Dicing Die Attach Film.
The Dicing Die Attach Film industry can be broken down into several segments, Film on Wire, Conductive Type, etc.
The top players cover Furukawa, Henkel Adhesives, LG, AI Technology, Nitto, LINTEC Corporation, Hitachi Chemical, etc. The Top 3 players in Global market was 83.55% in 2019, while the share of top 5 players was 96.69%. Henkel Adhesives is the leading supplier of Dicing Die Attach Film, the production of which reached 6.15 M PCS in 2019, accounting for about 29.34% of the Global market. Except policy affect, downstream demand is the key influence factor to the market.

Market Analysis and Insights: Global Dicing Die Attach Film Market
The global Dicing Die Attach Film market was valued at US$ 249.6 in 2020 and will reach US$ 346.2 million by the end of 2027, growing at a CAGR of 5.6% during 2022-2027.

Global Dicing Die Attach Film Scope and Market Size
The global Dicing Die Attach Film market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global Dicing Die Attach Film market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type and by Application for the period 2016-2027.

Segment by Type
Non-Conductive Type
Conductive Type
Conductive type is the most commonly used type, with about 75.7% market share in 2019.

Segment by Application
Die to Substrate
Die to Die
Film on Wire
Die to Substrate accounted for the largest market with about 80.82% of the Global consumption for Dicing Die Attach Film in 2019. Moreover, it is anticipated to grow at a CAGR of 7.49% during the forecast period. With over 12.45% share of in the Dicing Die Attach Film market, Die to Die was the second largest application market in 2019, and is anticipated to grow at a CAGR of 4.87%, in terms of consumption, during the forecast period.

The Dicing Die Attach Film market is analysed and market size information is provided by regions (countries). Segment by Application, the Dicing Die Attach Film market is segmented into North America, Europe, China, Japan, Southeast Asia, India and Other Regions.

By Company
Furukawa
Henkel Adhesives
LG
AI Technology, Inc.
Nitto
LINTEC Corporation
Hitachi Chemical