Metal plating (also known as electroplating or electrodeposition) is a coating technology that deposits a thin later of a metal or alloy on a conductive surface to impart particular functional or aesthetic properties. During the plating process, the object to be plated functions as the positively charged cathode while the desired plating material serves as the negatively charged anode and source of the metallic ions that will form the final coating. Immersing both materials in a bath or solution of electrolyte salts and adding an electrical current causes an oxidation/reduction reaction on the surface of the cathode where the metallic ions are deposited.
There are numerous metals commonly used as plating materials such as zinc, copper, chromium, and nickel. which impart wear and corrosion resistance, improve strength, and enhance solderability. Precious metal coatings are especially important to the electronics and semiconductor industries.
Market Analysis and Insights: Global Plating for Microelectronics Market
Due to the COVID-19 pandemic, the global Plating for Microelectronics market size is estimated to be worth US$ million in 2021 and is forecast to a readjusted size of US$ million by 2028 with a CAGR of % during the review period. Fully considering the economic change by this health crisis, by Type accounting for % of the Plating for Microelectronics global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR in the post-COVID-19 period. While by Type segment is altered to an % CAGR throughout this forecast period.
In the Chinese market, The major manufacturers are Dow, Mitsubishi Materials, Corporation, Heraeus, Xiliong Science, AtoTech, Yamato Denki, Meltex, Ishihara Chemical, Raschig GmbH, Japan Pure Chemical, Coatech, Magneto Special Anedes, Vopelius Chemie AG, Moses Lake Industries and JCU International, etc.
Global Plating for Microelectronics Scope and Market Size
The global Plating for Microelectronics market is segmented by company, region (country), by Type and by Application. Players, stakeholders, and other participants in the global Plating for Microelectronics market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type and by Application for the period 2017-2028.
Segment by Type
Gold
Zinc
Nickel
Bronze
Tin
Copper
Others
Segment by Application
MEMS
PCB
IC
Photoelectron
Others
By Region
United States
Europe
China
Japan
Southeast Asia
India
Other Regions
By Company
DOW
Mitsubishi Materials Corporation
Heraeus
XiLong Scientific
Atotech
Yamato Denki
Meltex
Ishihara Chemical
Raschig GmbH
Japan Pure Chemical
Coatech
MAGNETO special anodes
Vopelius Chemie AG
Moses Lake Industries
JCU International