Global Advanced Packaging Sales Market Report 2022

During the final stages of semiconductor development, a tiny block of materials (the silicon wafer, logic, and memory) is wrapped in a supporting case that prevents physical damage and corrosion and allows the chip to be connected to a circuit board. Typical packaging configurations have included the leadless chip carriers and pin-grid arrays of the 1980s, the system-in-package and package-on package setups of the 2000s, and, most recently, 2-D integrated-circuit technologies such as wafer-level, flip-chip, and through silicon via setups.
Market Analysis and Insights: Global Advanced Packaging Market
Due to the COVID-19 pandemic, the global Advanced Packaging market size is estimated to be worth US$ 14880 million in 2021 and is forecast to a readjusted size of US$ 14880 million by 2028 with a CAGR of 6.5% during the review period. Fully considering the economic change by this health crisis, by Type accounting for % of the Advanced Packaging global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR in the post-COVID-19 period. While by Type segment is altered to an % CAGR throughout this forecast period.
ASE, Amkor, SPIL, Stats Chippac, PTI, JCET, J-Devices, UTAC, Chipmos, Chipbond, STS, Huatian, NFM, Carsem, Walton, Unisem, OSE, AOI, Formosa and NEPES are the key manufacturters of Advanced Packaging.
Global Advanced Packaging Scope and Market Size
The global Advanced Packaging market is segmented by company, region (country), by Type and by Application. Players, stakeholders, and other participants in the global Advanced Packaging market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type and by Application for the period 2017-2028.
Segment by Type
3.0 DIC
FO SIP
FO WLP
3D WLP
WLCSP
2.5D
Filp Chip
Segment by Application
Analog & Mixed Signal
Wireless Connectivity
Optoelectronic
MEMS & Sensor
Misc Logic and Memory
Other
By Region
United States
Europe
China
Japan
Southeast Asia
India
Other Regions
By Company
ASE
Amkor
SPIL
Stats Chippac
PTI
JCET
J-Devices
UTAC
Chipmos
Chipbond
STS
Huatian
NFM
Carsem
Walton
Unisem
OSE
AOI
Formosa
NEPES