Global and China Dry Etching Equipment Market Insights, Forecast to 2027

Dry etching refers to the removal of material, typically a masked pattern of semiconductor material, by exposing the material to a bombardment of ions (usually a plasma of reactive gases such as fluorocarbons, oxygen, chlorine, boron trichloride; sometimes with addition of nitrogen, argon, helium and other gases) that dislodge portions of the material from the exposed surface.
Currently, global production of Dry Etching Equipment is concentrated. The top three manufacturers held 92.16% of the market, in terms of Dry Etching Equipment sales value in 2019.
As for the region, APAC is the largest consumption region, holding 76.07% sales revenue market share in 2019, followed by North America, with 13% market share.

Market Analysis and Insights: Global and China Dry Etching Equipment Market
This report focuses on global and China Dry Etching Equipment market.
In 2020, the global Dry Etching Equipment market size was US$ 9686.6 million and it is expected to reach US$ 14920 million by the end of 2027, with a CAGR of 6.4% during 2021-2027. In China the Dry Etching Equipment market size is expected to grow from US$ XX million in 2020 to US$ XX million by 2027, at a CAGR of XX% during the forecast period.

Global Dry Etching Equipment Scope and Market Size
Dry Etching Equipment market is segmented by region (country), players, by Type, and by Application. Players, stakeholders, and other participants in the global Dry Etching Equipment market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by region (country), by Type and by Application in terms of revenue and forecast for the period 2016-2027.
For China market, this report focuses on the Dry Etching Equipment market size by players, by Type, and by Application, for the period 2016-2027. The key players include the global and local players which play important roles in China.

Segment by Type
Inductively Coupled Plasma (ICP)
Capacitive Coupled Plasma (CCP)
Reactive Ion Etching (RIE)
Deep Reactive Ion Etching (DRIE)
Others

Segment by Application
Logic and Memory
MEMS
Power Device
Others

By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Colombia
Middle East & Africa
Turkey
Saudi Arabia
UAE

By Company
Lam Research
TEL
Applied Materials
Hitachi High-Technologies
Oxford Instruments
ULVAC
SPTS Technologies
GigaLane
Plasma-Therm
SAMCO
AMEC
NAURA