Global and United States Wafer Grinding Machine Market Insights, Forecast to 2027

Wafer Grinding Machine can reduce the size of the wafer in the production of integrated circuits, and make the wafer meet the requirements of more complex integrated circuits. The wafer substrate is thinned by thinning / lapping to improve the heat dissipation effect of the chip, which is also conducive to the later packaging process.

Market Analysis and Insights: Global and United States Wafer Grinding Machine Market
This report focuses on global and United States Wafer Grinding Machine market.
In 2020, the global Wafer Grinding Machine market size was US$ XX million and it is expected to reach US$ XX million by the end of 2027, with a CAGR of XX% during 2021-2027. In United States the Wafer Grinding Machine market size is expected to grow from US$ XX million in 2020 to US$ XX million by 2027, at a CAGR of XX% during the forecast period.

Global Wafer Grinding Machine Scope and Market Size
Wafer Grinding Machine market is segmented by region (country), players, by Type, and by Application. Players, stakeholders, and other participants in the global Wafer Grinding Machine market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by region (country), by Type and by Application in terms of revenue and forecast for the period 2016-2027.
For United States market, this report focuses on the Wafer Grinding Machine market size by players, by Type, and by Application, for the period 2016-2027. The key players include the global and local players which play important roles in United States.

Segment by Type
Semi-automatic
Full-automatic

Segment by Application
＜4 inch
4-8 inch
8-12 inch
Others

By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE

By Company
DISCO
ACCRETECH
CETGC
Suzhou Delphi Laser Co. Ltd.
SPTS Technologies Limited
Plasma-Therm LLC
Han's Laser Technology Industry Group Co. Ltd.
ASM Laser Separation International (ALSI) B.V.
N-TEC Corp