Global Multilayer Printed-wiring Board Market Analysis 2017-2022 and Forecast 2023-2028

Snapshot

Multilayer printed-wiring boards are made from the same base material with copper foil on the top & bottom and one or more“inner layer”cores. The number of “layers” corresponds to the number of copper foil layers.
The global Multilayer Printed-wiring Board market size is estimated at xxx million USD with a CAGR xx% from 2017-2022 and is expected to reach xxx Million USD in 2022 with a CAGR xx% from 2022 to 2028. The report begins from overview of Industry Chain structure, and describes industry environment, then analyses market size and forecast of Multilayer Printed-wiring Board by product, region and application, in addition, this report introduces market competition situation among the vendors and company profile, besides, market price analysis and value chain features are covered in this report.

Product Type Coverage (Market Size & Forecast, Major Company of Product Type etc.):

Layer 4~6
Layer 8~10
Layer 10+
Company Coverage (Company Profile, Sales Revenue, Price, Gross Margin, Main Products etc.):
Nippon Mektron
Zhen Ding Technology
Unimicron
Young Poong Group
Samsung Electro-Mechanics
Ibiden
Tripod
TTM Technologies
Sumitomo Electric SEI
Daeduck Group
Nanya PCB
Compeq
HannStar Board
LG Innotek
AT&S
Meiko
Chin-Poon
Shennan
WUS

Application Coverage (Market Size & Forecast, Different Demand Market by Region, Main Consumer Profile etc.):

Consumer electronics
Communications
Computer related industry
Automotive industry
Others

Region Coverage (Regional Production, Demand & Forecast by Countries etc.):

North America (U.S., Canada, Mexico)
Europe (Germany, U.K., France, Italy, Russia, Spain etc.)
Asia-Pacific (China, India, Japan, Southeast Asia etc.)
South America (Brazil, Argentina etc.)
Middle East & Africa (Saudi Arabia, South Africa etc.)